- Date：Nov 21, 2012 - Nov 24, 2012
- Location： Jakarta, Indonesia
- Booth Number：BE160
- Official Website：http://www.interplasticindonesia.com/
CoreTech System Co., Ltd.(Moldex3D) is pleased to announce that we will be exhibiting at ALLPLAS Indonesia 2012 this year, one of the most premier and biggest trade fairs for plastics and rubber in South East Asia region. ALLPLAS Indonesia is a premium exhibition providing the latest and the best in plastics industry for all manufacturing and processing industries alike. The ALLPLAS Expo will be held in Jakarta International Expo (JIExpo) Kemayoran on November 21 to 24, 2012.
CoreTech System (Moldex3D) is proud to take part in this event, and we will be featuring our powerful 3D industrial solution, “eDesign.” Moldex3D eDesign helps users to validate your part design at the earliest stage, visualize flow and thermal properties, and optimize processes before physical parts are built.
Moldex3D eDesign Features
We are located at Booth #: BE160. Curious about what we can do for your company? Bring your questions to our booth, chat with our enthusiastic Moldex3D staff, and experience the powerful benefits Moldex3D eDesign can bring to you first-hand.